Ophthalmic devices with organic semiconductor transistors

ABSTRACT

This invention discloses methods and apparatus to form organic semiconductor transistors upon three-dimensionally formed insert devices. In some embodiments, the present invention includes incorporating the three-dimensional surfaces with organic semiconductor-based thin film transistors, electrical interconnects, and energization elements into an insert for incorporation into ophthalmic lenses. In some embodiments, the formed insert may be directly used as an ophthalmic device or incorporated into an ophthalmic device.

FIELD OF USE

This invention describes ophthalmic devices with organic semiconductortransistors. In some embodiments, the ophthalmic device with organicsemiconductor transistor is formed on surfaces that occur on substratesthat have three-dimensional shapes are disclosed. In some embodiments, afield of use for the apparatus may include ophthalmic devices thatincorporate energization elements, inserts, and organic semiconductordevices.

BACKGROUND

Traditionally an ophthalmic device, such as a contact lens, anintraocular lens, or a punctal plug included a biocompatible device witha corrective, cosmetic, or therapeutic quality. A contact lens, forexample, may provide one or more of: vision correcting functionality;cosmetic enhancement; and therapeutic effects. Each function is providedby a physical characteristic of the lens. A design incorporating arefractive quality into a lens may provide a vision corrective function.A pigment incorporated into the lens may provide a cosmetic enhancement.An active agent incorporated into a lens may provide a therapeuticfunctionality. Such physical characteristics are accomplished withoutthe lens entering into an energized state. A punctal plug hastraditionally been a passive device.

More recently, it has been theorized that active components may beincorporated into a contact lens. Some components may includesemiconductor devices. Some examples have shown semiconductor devicesembedded in a contact lens placed upon animal eyes. It has also beendescribed how the active components may be energized and activated innumerous manners within the lens structure itself. The topology and sizeof the space defined by the lens structure creates a novel andchallenging environment for the definition of various functionalities.In many embodiments, it is important to provide reliable, compact, andcost effective means to energize components within an ophthalmic device.In some embodiments, these energization elements may include batteriesthat may in turn be formed from “alkaline” cell-based chemistry.Connected to these energization elements may be other components thatutilize electrical energy. In some embodiments, these other componentsmay include transistors to perform circuit functions. It may also bedesirable to include semiconductor devices in such devices organic.

SUMMARY

Accordingly, the present invention includes organic semiconductortransistors upon one or more ophthalmic lens insert surfaces which maycontain three-dimensional shapes and which may be inserted into anophthalmic device. In some embodiments, an ophthalmic lens insert isprovided that may be energized and incorporated into an ophthalmicdevice.

In some embodiments, the ophthalmic lens insert may be formed in anumber of manners to result in a three-dimensional shape upon whichorganic semiconductor transistors and other electrical devices may beformed. Non-limiting examples of electrical devices include resistors,capacitors, diodes, inductors, and similar such devices. Thereafter,energization elements may be formed in contact with or upon theseorganic semiconductor devices. In some embodiments, the energizationelements may be formed by applying films that contain batterycell-related chemicals to electrical interconnections. In some otherembodiments, the energizing elements may also be used in creatingcircuits of the organic semiconductor devices. In related embodiments,the application may be performed by printing processes that may applymixtures of the chemicals by using needles or other application tools.

An ophthalmic lens may be formed by encapsulating a three-dimensionallyformed ophthalmic lens insert in polymerized material. A method offorming the ophthalmic lens may include the polymerization of a reactivemixture between mold pieces where the ophthalmic lens insert is placedbefore polymerization. In some embodiments, numerous functionalcomponents or regions may be located within the ophthalmic lens insert.In some embodiments, the ophthalmic lens insert may contain at least onetransistor that is formed from an organic semiconductor layer. Othercommon elements may include, but are not limiting to, conductive traces,energization elements, activation elements, and active ophthalmicdevices. The active ophthalmic device may be capable of dynamicallychanging the focal characteristics of light that passes through theophthalmic lens. A non-limiting example of a component capable ofdynamically changing the focal characteristics may include a liquidmeniscus lens element. Non-limiting examples of activation elements mayinclude pressure sensitive switches, and magnetic field sensors.Non-limiting examples of magnetic field sensors may include Hall Effectsensors, photo detectors, sound detectors, and other devices capable ofdetecting electromagnetic signals, such as RF Signals.

In some embodiments, the organic semiconductor device may be formed fromn-type organic semiconductor layers. In other embodiments, the organicsemiconductor device may be formed from p-type organic semiconductorlayers. Still other cases may contain devices of both p- and n-typeorganic semiconductor layers.

In some embodiments, conductive traces may be formed from variousmetallic layers; including films of silver, gold, aluminum, and copperas a few examples. Other conductive traces may be formed of transparentmaterials such as, but not limiting to, indium tin oxide. In someembodiments, the energizing element may be located upon the conductivetraces or connecting to the conductive traces. A non-limiting example ofan energization element may be a battery. In some embodiments, thebatteries may be formed from a solid-state processing, including, butnot limiting to, various lithium battery processing. In someembodiments, batteries may be formed from wet-cell type formulations,such as but not limiting to, alkaline-type electrochemical cells.

In some embodiments, the ophthalmic lenses that are formed in thesemanners define novel types of ophthalmic devices. In some embodiments,the ophthalmic lens inserts are incorporated within the ophthalmicdevices. In some other embodiments, novel methods of producingophthalmic devices that include organic semiconductor devices aredescribed. Thin-film organic semiconductor devices may be formed from apatterned definition of electrodes, dielectrics, insulators, and layersof organic semiconductors. In some other embodiments, the resultingdevices may be formed upon ophthalmic lens insert surfaces with athree-dimensional character. In some other embodiments, thin-filmorganic semiconductor devices may be formed into three-dimensionalshapes after the formation of the organic semiconductor devices. In someembodiments, formed circuits comprising organic semiconductor devicesmay also be conductively attached to three dimensional insert surfacesby various means including, but not limiting to, solders and conductiveadhesives.

In some embodiments, the ophthalmic lens inserts that contain organicsemiconductor devices may be further processed to form conductive tracesand energization elements. Alternatively, in some other embodiments,conductive traces and energization elements may be formed prior to theinclusion of the organic semiconductor devices to three-dimensionalinserts.

In some embodiments, various combinations of the elements may definenovel embodiments. In some embodiments, energization elements withhigher electrical potential may be formed from the series combination ofindividual electrochemical cells. The higher potential energizationelements may provide energization to numerous activation elementsincluding, but not limiting to, pressure sensitive contact switches. Inaddition, the higher potential energization elements may provideenergization to the organic semiconductor circuits. In some embodiments,the novel combination of elements may define ophthalmic devices and themethods of forming them where the devices have simplified manufacturingprocesses due to the ability of organic semiconductors to be formed uponsubstrates like plastics at relatively low temperatures. Similarly, thenature of thin film transistors and other electrical devices based uponorganic semiconductors, along with other processing aspects of theformation of inserts, may allow for the enablement of thinner ophthalmicdevices.

In some embodiments, an active ophthalmic lens device is described thatcomprises a hydrogel skirt surrounding a three-dimensionally formedophthalmic lens insert device. In some embodiments, the ophthalmicinsert device comprises an energization element, at least a firstconductive trace, and a thin film transistor comprising an organicsemiconductor layer. In some other embodiments, the active ophthalmiclens may further comprise an active optical device capable of changingthe focal characteristics of the ophthalmic lens. In some otherembodiments, the active optical device may comprise a liquid meniscuslens element. In some other embodiments, the active optical device mayadditionally comprise an activation element. In some embodiments, theactivation element may comprise a pressure sensitive switch.

In some embodiments, the thin film transistor the of active ophthalmiclens device may comprise an n-type organic semiconductor layer. In someother embodiments, the n-type organic semiconductor layer may comprisecopper hexadecafluorophthalocyanine (F₁₅CuPc). In some otherembodiments, the thin film transistor the of active ophthalmic lensdevice may comprise a p-type organic semiconductor layer. In someembodiments, the p-type organic semiconductor layer may comprisepentacene. In some embodiments, the ophthalmic lens device mayadditionally comprise a second organic thin film transistor comprisingan organic semiconductor layer. In some embodiments, the second organicthin film transistor may comprise a p-type organic semiconductor layer.In some embodiments, the p-type organic semiconductor layer of thesecond organic thin film transistor comprises pentacene.

In some embodiments, the first conductive trace of the ophthalmic lensdevice may comprise a transparent electrode. In some embodiments, thetransparent electrode may comprise indium tin oxide (ITO). In some otherembodiments, the energization element of the ophthalmic lens device maybe comprised of more than one electrochemical cell which are connectedat least in part in a series manner. In some embodiments, the ophthalmiclens insert device may comprise an energization element, at least afirst conductive trace and a thin film transistor comprising an organicsemiconductor layer. In some embodiments, the thin film transistor maycomprise an n-type organic semiconductor layer. In some embodiments, then-type organic semiconductor layer of the ophthalmic lens insert devicemay comprise copper hexadecafluorophthalocyanine (F₁₅CuPc). In someother embodiments, the thin film transistor may comprise a p-typeorganic semiconductor layer. In some embodiments, the p-type organicsemiconductor layer comprises pentacene.

DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an exemplary substrate with three-dimensionalsurfaces upon which organic semiconductor devices may be definedconsistent with other related disclosures of the inventive entity.

FIG. 2 illustrates an exemplary flow for forming three-dimensionalsurfaces that may be consistent with the formation of organicsemiconductor devices.

FIG. 3 illustrates an integrated circuit device that is connected to athree dimensionally formed insert device with conductive traces in atleast two electrically conductive locations.

FIG. 4 illustrates an exemplary electronic circuit function utilizingorganic semiconductors included into an ophthalmic device.

FIG. 5 illustrates a representation of an insert device that includesthe circuit elements of FIG. 4.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to an apparatus for the formation oforganic semiconductor devices upon ophthalmic lens insert structures. Insome embodiments, the insert structure may have surfaces that havethree-dimensional topology. In the following sections, detaileddescriptions of embodiments of the invention will be given. Thedescription of both preferred and alternative embodiments are exemplaryembodiments only, and it is understood that to those skilled in the artthat variations, modifications and alterations may be apparent. It istherefore to be understood that said exemplary embodiments do not limitthe scope of the underlying invention.

GLOSSARY

In this description and claims directed to the presented invention,various terms may be used for which the following definitions willapply:

Encapsulate: as used herein refers to creating a barrier to separate anentity, such as, for example, a Media Insert, from an environmentadjacent to the entity.

Encapsulant: as used herein refers to a layer formed surrounding anentity, such as, for example, a Media Insert, that creates a barrier toseparate the entity from an environment adjacent to the entity. Forexample, Encapsulants may be comprised of silicone hydrogels, such asEtafilcon, Galyfilcon, Narafilcon, and Senofilcon, or other hydrogelcontact lens material. In some embodiments, an Encapsulant may besemipermeable to contain specified substances within the entity andpreventing specified substances, such as, for example, water, fromentering the entity.

Energized: as used herein refers to the state of being able to supplyelectrical current to or to have electrical energy stored within.

Energy: as used herein refers to the capacity of a physical system to dowork. Many uses within this invention may relate to the said capacitybeing able to perform electrical actions in doing work.

Energy Source: as used herein refers to device or layer that is capableof supplying Energy or placing a logical or electrical device in anEnergized state.

Energy Harvesters: as used herein refers to devices capable ofextracting energy from the environment and converting it to electricalenergy.

Functionalized: as used herein refers to making a layer or device ableto perform a function including for example, energization, activation,or control.

Lens: refers to any ophthalmic device that resides in or on the eye.These devices may provide optical correction or may be cosmetic. Forexample, the term lens may refer to a contact lens, intraocular lens,overlay lens, ocular insert, optical insert or other similar devicesthrough which vision is corrected or modified, or through which eyephysiology is cosmetically enhanced (e.g., iris color) without impedingvision. In some embodiments, the preferred lenses of the invention aresoft contact lenses that are made from silicone elastomers or hydrogels.Examples of hydrogels include, but are not limited to, siliconehydrogels, and fluorohydrogels.

Lens forming mixture or “Reactive Mixture” or “RMM” (Reactive MonomerMixture): as used herein refers to a monomer or prepolymer material thatmay be cured and crosslinked or crosslinked to form an ophthalmic lens.Various embodiments may include, but are not limited to, lens formingmixtures with one or more additives such as: UV blockers, tints,photoinitiators or catalysts, and other additives one might desire inophthalmic lenses such as, contact or intraocular lenses.

Lens Forming Surface: as used herein refers to a surface that is used tomold a lens. In some embodiments, such surface can have an opticalquality surface finish. An optical quality surface finish may indicatethat the surface is sufficiently formed and smooth so that a lenssurface fashioned by the polymerization of a lens-forming material incontact with the molding surface is optically acceptable. Further, insome embodiments, the lens forming may have a geometry that is necessaryto impart to the lens surface the desired optical characteristics,including without limitation, spherical, aspherical and cylinder power,wave front aberration correction, corneal topography correction, andcombinations thereof.

Lithium Ion Cell: as used herein refers to an electrochemical cell whereLithium ions move through the cell to generate electrical energy. Thiselectrochemical cell, typically called a battery, may be reenergized orrecharged in its typical form.

Substrate insert: as used herein refers to a formable or rigid substratecapable of supporting an Energy Source within an ophthalmic lens. Insome embodiments, the Substrate insert also supports one or morecomponents.

Mold: as used herein refers to a rigid or semi-rigid object that may beused to form lenses from uncured formulations. Non-limiting examples ofmolds include two mold parts forming a front-curve mold part and aback-curve mold part.

Ophthalmic Lens Insert: as used herein refers to media that may becontained within or on an ophthalmic device, wherein the ophthalmicdevice may be worn by a human being.

Optical Zone: as used herein refers to an area of an ophthalmic lensthrough which a wearer of the ophthalmic lens sees.

Organic Semiconductor: as used herein refers to a semiconductor that ismade from carbon-based materials.

PETG: as used herein refers to Polyethylene Terephtalate Glycol which isa clear amorphous thermoplastic that can be injection molded, sheetextruded, and colored during processing.

Power: as used herein refers to work done or energy transferred per unitof time.

Rechargeable or Re-energizable: as used herein refers to a capability ofbeing restored to a state with higher capacity to do work. Many useswithin this invention may relate to the capability of being restoredwith the ability to flow electrical current at a certain rate forcertain, reestablished time period.

Reenergize or Recharge: as used herein refers to restore to a state withhigher capacity to do work. Many uses within this invention may relateto restoring in a device the capability to flow electrical current at acertain rate for certain, reestablished period.

Released from a mold: as used herein means that a lens is eithercompletely separated from the mold, or is only loosely attached so thatit may be removed with mild agitation or pushed off with a swab.

Stacked: as used herein means to place at least two component layers inproximity to each other such that at least a portion of one surface ofone of the layers contacts a first surface of a second layer. In someembodiments, a film, whether for adhesion or other functions, may residebetween the two layers that are in contact with each other.

Stacked Integrated Component Devices (SIC-Devices): as used hereinrefers to a packaging product that is assembled from thin layers ofsubstrates-which may contain electrical and electromechanicaldevices-into operative integrated devices by means of stacking at leasta portion of each substrate layer upon each other. The substrate layersmay include component devices of various types, materials, shapes, andsizes. Furthermore, the layers may be made of various device productiontechnologies to fit and assume various contours, as it may be desired.

Referring now to FIG. 1, an ophthalmic lens is illustrated that includesone or more Organic Semiconductor devices within or onthree-dimensionally formed substrates. The substrates may also includeelectrical interconnects upon their respective surfaces. As illustrated,an exemplary three-dimensional substrate 100 with electrical traces uponit is depicted. The example may represent a portion of an ophthalmicdevice or in other terminology may represent a portion of an insertdevice for an ophthalmic application. One such embodiment may include anophthalmic device where an active focusing element is included. Suchactive focusing device may function while utilizing energy that may bestored in an energization element. The electrical traces upon the threedimensional substrate in FIG. 1 may provide a good substrate to formenergization elements upon. Furthermore, discrete organic semiconductordevices or circuits formed from organic semiconductor devices may beconnected to these electrical traces in various manners may be.

Referring back to FIG. 1, in some embodiments, in the ophthalmic device100, the three dimensional substrate may include, as for example, aregion 110 that is optically active. In some some embodiments, if theophthalmic device 110 is a focusing element, the active ophthalmicregion 110 may represent a front surface of an insert device thatcontains the focusing element through which light passes into a user'seye. Outside of this region 110, there may typically be a peripheralregion 112 of the ophthalmic device 100 that is not in a path opticallyrelevant to a person wearing the ophthalmic device relevant. In someembodiments, it may be appropriate to place components related to theactive focusing function in such a peripheral region 112, although it isfeasible-especially with very thin films and transparent electrodes-toplace devices in the optically active region 110. In some embodiments,the transparent electrodes may be formed from material including, butnot limiting to, indium tin oxide (ITO).

In another aspect, various components may be electrically connected toeach other by metal traces; some of these components may be or maycontain organic semiconductor devices. Metal traces may also provide auseful function to support the incorporation of energizing elements 114into the ophthalmic device 100.

Referring back to FIG. 1, in some embodiments, an energization element114 may be a battery. For example, the battery may be a solid-statebattery or a wet-cell battery. In either of these examples, there may bea minimum of at least two traces that are electrically conductive toprovide for an electrical potential formed between the anode of thebattery and a cathode of the battery. In the exemplary ophthalmic device100 of FIG. 1, in some embodiments, a battery connection 114 may bedefined in the region of an electrical trace 150. In some embodiments,the first energization element or battery 150 may be the anodeconnection and represent the (−) potential connection of an electricaltrace 114 to the ophthalmic device 100.

Referring back to FIG. 1, in some embodiments, the second energizationelement or battery 160 may be the cathode connection and represent the(+) potential connection of an electrical trace 114 to the ophthalmicdevice 100. In some embodiments, organic semiconductor elements may beconnected to anode 150, and cathode 160 connection points. In lattersections, some of these embodiments may be discussed in further detail.In one embodiment, an integrated circuit of organic semiconductordevices may be connected at anode 150 and at cathode 160 as well asother locations. In other embodiment types, the organic semiconductordevices may be formed directly upon the substrate surface of ophthalmicdevice 100 and either connect with anode 150 and cathode 160 or areintegrally connected by using the same metallurgy for interconnectionswithin the circuit devices themselves.

Referring back to FIG. 1, it may be observed that the electrical tracesthat are connected to anode 150 and cathode 160 are isolated traces 140and 170 respectively that lay close to neighboring traces 130 and 180respectively. The neighboring traces 130 and 180 may represent anopposite battery chemistry or electrode type when battery elements areproduced upon these traces. Thus, a neighboring trace 130 may beconnected to a chemical layer that may make it function as a cathode 160of a battery cell between the neighboring trace 130 and the isolatedtrace 140.

In FIG. 1, the neighboring traces 130 and 180 may be observed to connectto each other through the trace region 120. The trace region 120 may, insome embodiments, be partially covered or not covered by any chemicallayers. Therefore, the trace region 120 functions for the purpose ofelectrical interconnection. It may be apparent that in this example,there may be two pairs of electrical cells configured as batteries andthat the nature of the layout and design connects these two batteries ina series connection. The total electrical performance acrossenergization elements 150 and 160 may be considered a combination of twobattery cells.

In embodiments that incorporate organic semiconductor devices, theenergization voltage requirements may be in the 10's of volts andaccordingly there may be numerous trace regions 120 that are formed toallow the energization elements 150 and 160 to define a higher totalenergization voltage.

An alternative set of embodiments may be described in reference to FIG.2. In these alternative embodiments, a set of conductive features 200are formed which, after processing, become interconnects on a threedimensional surface are formed while base materials are still kept in aplanar shape. Proceeding to step 201, a base substrate, which in someembodiments may be consistent with forming a part of an ophthalmic lensor lens insert, is formed. Non-limiting examples of the base substratematerial may include PETG. In some embodiments, if the base substrate isformed from a conductive material, its surface may be coated with aninsulator material to remain consistent with formation of interconnectson the surface.

In some embodiments, organic semiconductor processing may occur ontothis substrate surface. In these cases, the processing steps, which willbe described in later sections, may have already been performed upon thesubstrate and therefore the substrate of 201 may actually includeorganic semiconductor devices upon its surface. In some embodiments,subsequent processing steps of FIG. 2 may be performed upon these deviceregions and the flat substrates. In other embodiments, the organicsemiconductor devices may be formed in a similar manner to the processof FIG. 2, but in a parallel processing manner.

Referring back to FIG. 2, the substrate base is further processed atstep 202. In some embodiments, a conductive film is applied upon thebase substrate. The conductive film may comprise alternatives consistentwith the art herein defined for this embodiment and the others to bediscussed. In some embodiments, the film may be formed of a malleableconductive material and of a sufficient thickness to avoid mechanicalfailure during the later forming processes.

The conductive film may be deformed as the flat substrate base is formedinto a three dimensional substrate. In some embodiments, the film may becomprised of a gold film.

Referring back to FIG. 2, at step 203, the conductive film may bepatterned to form a desired shape after the flat pieces are formed intothree-dimensional shapes. The depicted shapes are exemplary set ofshapes that would form the three-dimensional desired result. There maybe numerous manners to pattern the conductive layer, including, but notliming to a gold conductive layer. A non-limiting example of thepatterning step 203 may include photolithography with chemical etching.Alternatively, laser ablation may be used in the manners previouslydescribe to create the appropriate shaped features. In some embodiments,the imaged conductor patterns may have been deposited through a screendirectly into the patterned shape.

Referring back to FIG. 2, in some embodiments, At step 204, the stack ofthe base substrate with overlying conductive features may beencapsulated in an overlying material. In some embodiments, athermoforming material, such as, but not limiting to, PETG may providean exemplary film that could be used in this manner. In someembodiments, encapsulation of the formed features may result in adesirable stability of the features. In some other embodiments, a stackof films may be deformed during thermoforming processes to create thedesirable three-dimensional shapes. In some embodiments, as part of step204, a first planar thermoforming process may occur to seal theoverlying insulative material to the underlying substrate base and tothe defined features in the conductive film. Additionally, a cutout forthe central optic zone region is illustrated by the non-shaded centralcircular region since the central optic region may perform betterwithout a composite film.

Referring back to FIG. 2, in at step 205, the stack of base material,formed conductive features, overlying encapsulating layers, andinsulating layers may be subjected to a thermoforming process to resultin a three-dimensional shape. In some embodiments, the shape mayincorporate the electrical interconnects resulting from thethermoforming process. In some embodiments where the processing at step204 included an overlying insulating layer, vias may be formed into theinsulating material. At step 206, the three-dimensional shape withincorporated electrical interconnects is processed to create electricalconductive vias and openings at appropriate locations. There may benumerous manners to create these vias and openings; however, in anon-limiting example, laser ablation processing may be used to createprecise openings by ablating the top insulator layer and exposing anunderlying conductive film area. The resulting three-dimensional surfacewith electrical interconnects may be significantly similar to thatproduced in other manners discussed herein.

Referring now to FIG. 3, electrically connecting Organic Semiconductordevices upon three dimensionally formed or formable insert substratesare illustrated. in some embodiments, an exemplary close up of a portionof the three dimensionally formed insert component 300 is depicted. Thelocation indicated by region 305, may represent either an attachedintegrated circuit device that may contain organic semiconductordevices, or it may represent the region of the insert surface upon whichorganic semiconductor devices have already been formed or may be formedin subsequent processing.

In some embodiments, the regions 310 and 320 may represent locationswhere the larger interconnection features of the insert device makeelectrical connection to components in the circuit region. In theexemplary illustration in FIG. 3, the organic semiconductor componentsmay be cut out or diced from a substrate and subsequently connected tothe insert. The depiction in FIG. 3, therefore, may represent aflip-chip orientation in regions 310 and 320, but there may beinterconnect features such as, but not limiting to, flowable solderballs, or conductive epoxy connections under the chip surface.

In either of the embodiment types, the nature of the connection schemesmay ensure that organic semiconductor devices in the circuit region 305are connected through interconnect traces to other elements. These otherelements may include, but are not limited to, energization elements,sensors, active optical elements, other integrated circuit designs,medicament pumps, and medicament dispersal devices.

In some embodiments, Organic Semiconductor Transistors may be formed onOphthalmic Lens Insert surfaces. In some embodiments, there may benumerous methods of incorporating organic semiconductor devices intoophthalmic insert devices. In some embodiments, there may be numerousmethods of forming the organic semiconductor devices to be incorporated.In some other embodiments, organic semiconductor devices are formedbased on field-effect semiconducting device structures. Non-limitingexamples of these devices include designs that have a gate electrodelying under the semiconductive layer, where additional embodimentsinclude a gate electrode above the semiconductor layer, or have a gateelectrode at the semiconductor layers.

In some embodiments, the methods and apparatus mentioned in the priorsections may create various ophthalmic devices. Referring to FIG. 4, anexemplary electronic circuit 400 is described, which is consistent withthe implementation of an ophthalmic device with an energization element.In some embodiments, the electronic circuit 400 responds to a mechanicalswitch as an activation device and applies electrical potential acrossan active ophthalmic device including a meniscus based focusing element,when the electronic circuit 400 is activated.

Referring back to FIG. 4, in some embodiments, an energization element410 is depicted. In some embodiments, the energization element 410 maybe comprised of various and numerous battery cells connected in a seriesmanner, since the electronic circuit 400 may contain organicsemiconductor transistors. As an example, in some embodiments, adequatecells may be connected to generate an electrical potential in theenergization element of approximately 20 Volts. In other embodiments, avariety of a number of cells may be connected together to generateenergization potentials ranging from approximately 10 Volts to 100Volts.

Continuing with FIG. 4, in some embodiments, the energization element410 may apply its potential across an active ophthalmic element 420. Theactive ophthalmic element 420 may be a meniscus lens-based device thatresponds by changing the shape of a meniscus based on the application ofpotential across two immiscible fluids. In some embodiments, themeniscus lens-based device functions essentially as an extremely highimpedance capacitor from an electrical perspective. Therefore, theenergization element 410 may initially charge the active ophthalmicelement 420 through a first resistive element 470. When the potentialfully charges the capacitive element, the energization element 410 willthereafter will not have a large dissipative load on it. In some otherembodiments, a start up circuitry may be defined to further ensure thatthe energization element is not discharged.

In some embodiments, referring back to FIG. 4, the electronic circuit400 may further include a “D-FlipFlop” circuit 450 based on a circuitusing the complementary n- and p-type organic semiconductor transistors.In some embodiments, the D-FlipFlop circuit 450, may have its D and Qoutputs connected together, as well as the Set (S) and Reset (R) beingconnected to ground. In some other embodiments, the output of Q willthen flip from one state to the next every time there is a voltage levelchange at the Clock (CP) input. That input will be set by theenergization source 410 through a second resistive element 440. In someembodiments, when an external switch 860 is activated as may be the casewhen a user exerts pressure onto a pressure-sensitive switch, thepotential at CP is brought close to ground, and this level change maytoggle the state of the D-FlipFlop 450. In some other embodiments, whenthe level changes at Q, a transistor 430 connected thereto may“Turned-On” and conduct across the active optical device effectivelyshorting the device and allowing the state of the active optical stateto be changed. There may be numerous manners to activate and control thestatus of the exemplary circuit embodiment.

Proceeding to FIG. 5, in some embodiments, a physical representation foran insert component piece 900, which is consistent with the embodimentsof FIG. 4, is presented. In some embodiments, a first connection 510 forthe meniscus lens device may be found. As mentioned, there may benumerous energization cells 520 that are connected in series in order togenerate the necessary potentials required for operation of organicsemiconductor-based circuits. In some embodiments, the combination ofenergizing cells 520 may define an energization element of roughly 20volts. In some other embodiments, the energization element 520 maycomprise contact points 530 and 540.

In some embodiments, the D-Type FlipFlop 550 may be found in the insertcomponent piece 500. In some embodiments, the D-Type FlipFlop 550 maycontain both the n- and p-type organic semiconductor transistors.Furthermore, the resistive elements may be defined in the D-TypeFlipFlop 550 as well (not shown). In some embodiments, a second contact560 that defines the alternative connection point for the meniscus lensmay be present. In some other embodiments, a pressure sensitive switch570 may be formed from spaced metallic traces that upon deflection bypressure, completes a contact between the two sides.

Specific examples have been described to illustrate aspects of inventiveart relating to the formation, methods of formation, and apparatus offormation that may be useful to form energization elements uponelectrical interconnects on three dimensional surfaces. These examplesare for said illustration and are not intended to limit the scope in anymanner. Accordingly, the description is intended to embrace allembodiments that may be apparent to those skilled in the art.

1. An ophthalmic lens device comprising: a three dimensionally formedophthalmic insert device; an energization element fixedly attached tothe ophthalmic insert device; a thin film transistor comprising anorganic semiconductor layer also fixedly attached to the ophthalmic lensdevice; and a conductive trace providing electrical communicationbetween the energization element and the thin film transistor.
 2. Theophthalmic lens device of claim 1, additionally comprising a hydrogellayer encapsulating an ophthalmic lens device.
 3. The ophthalmic lensdevice of claim 2 additionally comprising: an active optical devicecapable of changing the optical characteristics of the ophthalmic lens.4. The ophthalmic lens device of claim 3 wherein: the active opticaldevice comprises a liquid meniscus lens element.
 5. The ophthalmic lensdevice of claim 4 additionally comprising: an activation element.
 6. Theophthalmic lens device of claim 5 wherein: the activation elementcomprises a pressure sensitive switch.
 7. The ophthalmic lens device ofclaim 1 wherein: the thin film transistor comprises a n-type organicsemiconductor layer.
 8. The ophthalmic lens device of claim 7 wherein:the n-type organic semiconductor layer comprises copperhexadecafluorophthalocyanine (F₁₅CuPc).
 9. The ophthalmic lens device ofclaim 1 wherein: the thin film transistor comprises a p-type organicsemiconductor layer.
 10. The ophthalmic lens device of claim 9 wherein:the p-type organic semiconductor layer comprises pentacene.
 11. Theophthalmic lens device of claim 7 additionally comprising: a secondorganic thin film transistor comprising an organic semiconductor layer.12. The ophthalmic lens device of claim 11 wherein: the second organicthin film transistor comprises a p-type organic semiconductor layer. 13.The ophthalmic lens device of claim 12 wherein: the p-type organicsemiconductor layer of the second organic thin film transistor comprisespentacene.
 14. The ophthalmic lens device of claim 1 wherein: the firstconductive trace comprises a transparent electrode.
 15. The ophthalmiclens device of claim 14 wherein: the transparent electrode comprisesindium tin oxide.
 16. The ophthalmic lens device of claim 1 wherein: theenergization element is comprised of more than one electrochemical cellwhich are connected at least in part in a series manner.
 17. Anophthalmic lens insert device comprising: an energization element, atleast a first conductive trace and a thin film transistor comprising anorganic semiconductor layer.
 18. The ophthalmic lens insert device ofclaim 17 wherein: the thin film transistor comprises an n-type organicsemiconductor layer.
 19. The ophthalmic lens insert device of claim 18wherein: the n-type organic semiconductor layer comprises copperhexadecafluorophthalocyanine (F₁₅CuPc).
 20. The ophthalmic lens insertdevice of claim 1 wherein: the thin film transistor comprises a p-typeorganic semiconductor layer.
 21. The ophthalmic lens insert device ofclaim 20 wherein: the p-type organic semiconductor layer comprisespentacene.